Room 400421, Semiconductor Building, Sungkyunkwan University (성균관대학교 자연과학캠퍼스 반도체관 400421)
학력 Education
9/1995 – 1/2001 STANFORD UNIVERTY, Stanford, CA Ph.D. degree in Materials Science and Engineering (Advisor: Robert Sinclair) Thesis title: Reactions and microstructural behavior at the Cu/Ta interfaces.
34/1998 – 1/2000 STANFORD UNIVERSITY, Stanford, CA. Master of Science degree in Electrical Engineering (Advisor: S. Simon Wong) - Analog/mixed circuit design, - Device physics and silicon technology.
53/88 – 2/1990 KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, Seoul, Korea Master of Science degree in Materials Science and Engineering (Advisor: Jai-Young Lee) – Hydrogen storage metals and their applications to the heat pump.
73/1984 – 2/1988 SEOUL NATIONAL UNIVERSITY, Seoul, Korea Bachelor of Science degree in Metallurgical Engineering - Physical metallurgy and solid state physics.
약력/경력 Experience
3/2007 – present Sungkyunkwan University, Suwon, Korea Professor, College of Information and Communication Engineering
– High Speed Serial Interface: USB, HDMI, LVDS, Inductive Link
– Energy Harvesting System, PMIC/BMIC
– Design for Testability (DFT) of 3-D IC.
– Standards and Specification.
– Cross-Point Memory Architecture with Resistive Memory Cells
– Non-Volatile Memory IP.
13/2006 – 2/2007 Hanyang University, Ansan, KOREA. Assistant Professor, Division of Materials and Chemical Engineering
– Electronic Materials and Devices Lab.
11/2001 – 3/2006 SAMSUNG ELECTRONICS CO., LTD, Hwaseong, KOREA.
Principal Design Engineer in Advanced Technology Development Team (2/2005 – 2/2006)
– In charge of low power technology (Transistor, circuit & logic level approaches)
Principal Design Engineer in DRAM Design Team (1/2001 – 2/2005)
– Super High Performance DRAM design (tRC of 10ns, 10Gbps Data Rate)
– Advanced DRAM design including Direct Rambus DRAM and XDR DRAM.
– New memory development (PRAM, Scalable Gain-Cell Memory, Multimedia DRAM)
– Core circuit design for DRAM.
16/2000 – 1/2001 MAXIM INTEGRATED PRODUCTS, Sunnyvale, CA
Associate Member of Technical Staff
– 16-bit D/A converter design.
– Digital potentiometer design
16/1999 – 9/1999 INTEL Corporation, Portland, OR, Summer Intern
– Diffusion and drift of copper in intermetallic dielectrics.
– Life time test (Bias Temperature Stressing) of intermetallic dielectrics.
– Copper/tantalum interaction at high temperature.
12/1990 – 7/1995 SAMSUNG ELECTRONICS CO., Semiconductor R&D Center, Kiheung, Korea
Staff Engineer
– In charge of developing thin capacitor dielectric films (SiO2, SiN, Ta2O5 and [BaSr]TiO3)
– Process modules to fabricate three dimensional capacitor structures for DRAM applications.
– Maintenance of chemical vapor deposition systems, furnaces, and sputters.
Leading member
– Joint development project with LAM RESEARCH CO., Fremont, CA (5/1991 – 11/1992)
– Development of CVD system for Ta2O5 thin film.
Acting member
– Joint 256Mb DRAM development project with NEC, Tokyo, Japan (1/1994 – 6/1995).
– Members: D. Chin, C.-G. Hwang, M.-Y. Lee, S.-T. Ahn, S.-W. Kim, E.S. Kim, & myself
관심분야 Research Interest
Integrated Process and TEG Platform Technology Development for Emerging Semiconductor DevicesMinistry of Science, ICT and Future Planning, 2019~2022(신소자 TEG 개발, Neural Network H/W platform 설계, 등)
1Reconfigurable Logic Device and Architecture Development Ministry of Science, ICT and Future Planning, 2016~2021 (나노스위치 집적공정개발, 재구성 아키텍처 개발, 기계학습 H/W 설계, 등)
1Emerging Non-Volatile Memories and their Applications Samsung Electronics, 2015~2020 (TCAM/STT-MRAM/ReRAM core, peri circuit 설계, 등)
1Technology Trends in Vertical NAND Flash Memory Samsung Electronics, 2016~2016 (Vertical NAND Flash 벤치마킹, QLC 연구 등)
1Development of Evaluation Technology in 3D IC Ministry of Trade, ICT and Industry and Energy, 2016~2020
1Standards in Healthcare Sensor Ministry of Trade, ICT and Industry and Energy, 2016~2019
논문 Journal Article
Jong-Moon Choi, et. al., “A Highly Linear Neuromorphic Synaptic Device based on Regulated Charge Trap/Detrap,”IEEE, Electron Devices Letters, September 2019 (Early Access)
2Sung-Yong Kim, et. al.,“Dynamic Power Reduction of TCAM using Selective Precharging of Match lines”, IEEK J. Semiconductor Technology and Science, (submitted)
3Jisu Min, et. al., “A Study of Read Margin Enhancement for 3T2R Nonvolatile TCAM Using Adaptive Bias Training” IEEE, Transactions on VLSI Systems, vol. 27, no. 8, pp. 1840-1850, August 2019
4Xuefan Jin, Kee-Won Kwon, Young-Shig Choi, and Jung-Hoon Chun, “A Dual-loop Phase Locked Loop with Frequency to Voltage Converter”, IEEK J. Semiconductor Technology and Science, vol. 19, no. 3, pp. 292-299, June 2019
5Eun-Je Park, Jong-Moon Choi, and Kee-Won Kwon, “Behavior Modeling for Charge Storage in Single-poly Floating Gate Device” J. of Nanoscience and Nanotechnology, vol.19, no.10, pp.6727-6731, October 2019